- For IC decapsulation
- Two independent high resolution Ethernet cameras with 5Mp
Features
- The entire process is 100% controllable by the operator, allowing one to determine the precise depth, location, and geometry of the ablation area through our User Interface.
- Real time color vision system provides a continuous control of the ablation process.
- Three fully CNC controlled axes and two 5Mp independent high resolution Ethernet cameras ensure the precise positioning.
- Integrated red laser pointer for comfortable adjustment and positioning of the work piece.
- No destruction of wires during opening
- Laser class one safety cabinet, no additional cost for laser protection.
Application
- Semiconductor failure analysis; IC decapsulation and removing large filler mold compounds, such as revoe resin and plastics; Expose Wire Bonds
Specifications
|
Laser type |
Ytterbium fiber laser |
|
Wavelength |
1064 nm |
|
Pulse repetition frequency |
1.6 kHz – 1 MHz |
|
Beam Diameter |
Less than 60um |
|
Power |
20 W |
|
Inscription area |
max. 300 x 300 mm |
|
Control |
CNC control |
|
System software |
Windows 7 |
|
Measurements |
1493 x 860 x 1777 mm (L x W x H) |
|
Network connection |
Yes |
Materials
|
Material |
Engrave |
|
Stainless |
√ |
|
Coated Metals |
√ |
|
Brass |
√ |
|
Copper |
√ |
|
Gold |
√ |
|
Silver |
√ |
|
Titanium |
√ |
|
Bare Metals |
√ |
|
Ruber |
√ |
|
PP |
√ |
|
PS |
√ |
|
PP |
√ |
|
ABS |
√ |
|
PVC |
√ |
|
PE |
√ |
|
Crystal |
√ |
|
Ceramic |
√ |
|
Diamond |
√ |
|
Gemstone |
√ |
|
Cloth |
√ |
|
Leather |
√ |
|
Fiber |
√ |
|
Carbon Fiber |
√ |
